| Modeling of reactive sputtering of compound materials S Berg, HO Blom, T Larsson, C Nender Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 5 (2 …, 1987 | 514 | 1987 |
| Predicting thin‐film stoichiometry in reactive sputtering S Berg, T Larsson, C Nender, HO Blom Journal of Applied Physics 63 (3), 887-891, 1988 | 243 | 1988 |
| Process modeling of reactive sputtering S Berg, HO Blom, M Moradi, C Nender, T Larsson Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 7 (3 …, 1989 | 145 | 1989 |
| Process modeling of reactive sputtering S Berg, HO Blom, M Moradi, C Nender, T Larsson Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 7 (3 …, 1989 | 145 | 1989 |
| A physical model for eliminating instabilities in reactive sputtering T Larsson, HO Blom, C Nender, S Berg Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 6 (3 …, 1988 | 140 | 1988 |
| The use of nitrogen flow as a deposition rate control in reactive sputtering S Berg, T Larsson, HO Blom Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 4 (3 …, 1986 | 91 | 1986 |
| Reactively sputtered titanium boride thin films HO Blom, T Larsson, S Berg, M Östling Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 7 (2 …, 1989 | 36 | 1989 |
| Reactive sputtering of titanium boride T Larsson, HO Blom, S Berg, M Östling Thin Solid Films 172 (1), 133-140, 1989 | 35 | 1989 |
| A model for reactive sputtering with magnetrons T Larsson Vacuum 39 (10), 949-954, 1989 | 29 | 1989 |
| Mass flow limitations in reactive sputtering HO Blom, S Berg, T Larsson Thin Solid Films 130 (3-4), 307-313, 1985 | 28 | 1985 |
| Modelling of reactive sputtering of titanium boride T Larsson, S Berg, HO Blom Thin Solid Films 172 (2), 241-249, 1989 | 12 | 1989 |
| Properties of titanium boride films prepared by reactive sputtering HO Blom, T Larsson, S Berg, M Östling Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 6 (3 …, 1988 | 7 | 1988 |
| Si/Ti/TiB2/Al structures investigated as contacts in microelectronic devices T Larsson, U Wennström, H Norström, HO Blom, S Berg, I Engström Solid-state electronics 32 (5), 385-389, 1989 | 3 | 1989 |
| Reactive sputtering applied to microelectronic devices. TBG Larsson | 1 | 1990 |
| CRISPR-Drawr, a tool to design mutagenic primer T Larsson DiVA, Exam work, 2023 | | 2023 |
| Modeling of reactive sputtering S Berg, C Nender, HO Blom, T Larsson 1st Int symposium on sputtering and plasma processes (ISSP), Tokyo, Japan, 9-18, 1991 | | 1991 |
| Reactive sputtering applied to microelectronic devices T Larsson Acta Universitatis Upsaliensis, 1988 | | 1988 |
| Electrical properties and thermal stability of Si/ti/TiB1/A1 contacts applied to microelectronic fabrication T Larsson, U Wennström, H Norström, HO Blom, S Berg, I Engström 13th Nord Semiconductor Meeting, Stockholm, 1988 | | 1988 |
| Reactive sputtering of ZrN for contacts to IC-circuits HO Blom, S Berg, T Larsson 11th Nord Semiconductor Meeting, Esbo, Finland, 1984 | | 1984 |
| Styrning av mätutrustning med mikrodator T Larsson UPTEC Exam work, 1983 | | 1983 |
